SINGAPORE OUTSOURCING COMPANY

DESCRIPTION
Our company designs and manufactures stamping dies, and engages in high speed metal stamping of electronic parts in Singapore, draw forming metal stamping in Japan, and tool and die making in China. Through our network of manufacturing contacts in China, we are able to assist manufacturers who seek to outsource specific parts manufacturing to China suppliers for cost competitiveness reasons. We possess the necessary managerial and technical expertise to manage the logistics and inventory, conduct in-house quality audit and on-site Final OQC to ensure JIT delivery of your parts to your door step.

SKILLS
Our associate factories are in the following production:

Semiconductor Chip Design and Manufacture
Design - Wafer Fab (0.35 microns, 200mm diameter wafer), IC and Smartcard Packaging & Testing;

Plastics Injection Molding - Design and Fabricate injection molds, Single/Double Injection Molding, Plating, Paint spraying and other secondary processes;

Custom Metal Stamping, Design and Fabricate Tool and Die, IC leadframe and Connector stamping;

PCB Fabrication - 0.1mm to 2.4mm thick printed circuit boards, Multilayer PCBs from miniature to big size boards;

CNC Machining, Lathe Turning, Gear Cutting and Gear Hobbing
Manufacturing of miniature metal parts with less than 10 microns accuracy;

Our Chinese associate factories are located in:
Beijing, Dongguan, Ningbo,
Shanghai, Shenyang, Wuxi

TERMS
To be discussed on project basis.

LOCATION Singapore - Singapore, Singapore EMPLOYEES 20-49 YEARS IN BUSINESS 1-3 years CONTACT INFORMATION Register or Login to view the outsourcing service provider contact information.